Measurement of object layer thickness using handheld ultra-sonic devices and methods thereof
US6585652B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jul 29, 2002 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Jul 29, 2022 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B8/4272
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present invention provides for a method of measuring layer thickness in an object comprising 1) transmitting at least a first and a second ultra-sonic pulse from at least a first and second position, 2) measuring at least one reflective distance from the first pulse and at least one reflective distance from the second pulse, wherein the reflective distance is from the object's external surface (or probe) to a reflective interface of at least one layer, 3) selecting the reflective distance having the shortest reflective distance to indicate the distance between the external surface (or probe surface) and the reflective interface of at least one layer, wherein the selecting of the shortest reflective distance reduces ultra-sonic transmission parallax of the first and second pulses relative to a plane in the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.