Pressure-wave sensor with a leveling support element
US6585659B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2000 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Jan 26, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and an apparatus for fabricating a pressure-waveform sensor with a leveling support element. One embodiment provides a pressure-waveform sensor having a housing, a support element, and a piezoelectric element having a first end secured between the support element and the housing, and a second end in a cantilevered orientation. The support element and the piezoelectric element together form a plurality of support regions to level the piezoelectric element and relative to the housing. In some embodiments, the support element includes a ring having three slots spaced apart on one face of the ring, or one or more support regions formed with a shim having a thickness equal to a thickness of the piezoelectric device, or support regions that are integral to the support element. Another aspect provides a method for fabricating a pressure-waveform sensor. The method includes the steps of forming a housing structure with an inner lip, and supporting a cantilevered piezoelectric element with a support structure such that contact is made with the inner lip at a plurality of points in order to level the piezoelectric element relative to the inner lip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.