Electrical circuit board and a method for making the same
US6585903B1 · kind B1 · utility
8Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2000 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Sep 6, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics by causing a first insulating layer to separate from a portion of a first conductive layer of the multi-layer electronic circuit board 10 which allows for communication by and between some or all of the various component containing surfaces, and portions of the formed multi-layer electrical circuit board 10, which selectively allows components contained within and/or upon these portions and surfaces to be interconnected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.