Photocurable resin composition for sealing material and method of sealing
US6586496B1 · kind B1 · utility
31Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2001 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Mar 23, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/287
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photo-curable resin composition for sealing material, which is superior in the photo-curing performance and in the prompt curing property and is better in the adhesive property, in the resistance to moisture permeation and in the heat resistance, the photo-curable resin composition comprising(A) a compound having oxetane ring,(B) a photoinitiator for cationic polymerization and(C) a silane coupling agent,wherein the composition has a viscosity in the range from 0.01 to 300 Pa.s at 25° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.