Ceramic header assembly
US6586678B1 · kind B1 · utility
22Cited by
6References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2002 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Feb 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02469
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An improved transistor header assembly incorporating a rectangular platform perpendicularly bisecting the base of the transistor header. The ceramic platform provides the ability to house multiple electrical components and/or devices on either side of the base. The platform has a higher thermal conductivity than the base of a standard header. In addition, the platform increases the electrical input/output density of the header by increasing the number of potential electrical connections between the two sides of the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.