Bump electrode and printed circuit board
US6586685B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 16, 1999 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Mar 16, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bump electrode is a bump made from a fused metal in a shape of one of a circular cylinder, a cone, a pyramid, a frustum of a cone, and a frustum of a pyramid, formed on a substrate. A printed circuit board has a substrate and a wiring pattern provided thereon. The wiring pattern is made from one of a paste and a fused metal and has a cross-section at right angles with respect to an extending direction of the wiring pattern with such an aspect ratio of a depth thereof to a width thereof that the depth thereof is greater than a depth with an aspect ratio of 1:5 and the width thereof is smaller than a width with an aspect ratio of 1:5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.