Substrate for an electronic power circuit, and an electronic power module using such a substrate
US6586783B2 · kind B2 · utility
3Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2002 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Jan 31, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic power circuit substrate including a wafer of electrically insulating material, wherein said wafer presents a face supporting one or more conductive tracks directly connected to one or more electronic power components, said conductive tracks being obtained by fine metallization of said face to a thickness that is less than 150 &mgr;m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.