Integrated circuit device with covalently bonded connection structure
US6586843B2 · kind B2 · utility
18Cited by
11References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2001 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Nov 8, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit board substrate. The bumps and the substrate are formed from similar materials that allow control of the degree of latency for each element and produce a covalently bonded laminate structure when the bumps and substrate are brought together. The covalently bonded structure decreases bump fatigue to lengthen the operative life of the flip-chip device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.