Semiconductor device module and a part thereof
US6586845B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1999 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Oct 25, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device module includes one or a plurality of semiconductor devices, each including a semiconductor element having first and second surfaces, pads formed on the first surface on which electrode terminals are also formed and curved, flexible wires having first ends fixed to the pads. The semiconductor devices are mounted on a mounting board such that second ends of the wires are connected to terminals on the mounting board. A heat spreader has a recessed inner wall and a peripheral edge which is adhered to or engaged with the mounting board in such a manner that the second surfaces of the semiconductor elements face a bottom interior surface of the recessed inner wall. A thermal conductive resin layer of a substantially constant thickness is disposed between the second surface of the semiconductor element and the bottom interior surface of the recessed inner wall of the heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.