Hybrid optical module
US6587287B2 · kind B2 · utility
1Cited by
4References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2000 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Dec 28, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B7/13
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic substrate 11 is used, and a prism 14 serving as a component of a hybrid optical module and a chip 12 on which an optoelectric converting element is mounted are mounted on different layers of the multilayer ceramic substrate. The thickness of the chip on which the optoelectric converting element is mounted is substantially equal to the depth of the layer of the multilayer ceramic substrate on which the chip is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.