Mounting system for high-voltage semiconductor device
US6587344B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 13, 2002 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Feb 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting system for mounting a semiconductor device to a heat sink is disclosed. The mounting system is for mounting a semiconductor package having a semiconductor die, a heat spreader, a body of non-conductive material around the semiconductor die, and a plurality of leads to a heat sink comprising a sheet of thermally conductive material. The mounting system comprises two primary elements: a rigid retainer and a pressure clamp. The rigid retainer comprises a block of non-conductive material having recess open to at least two adjacent faces of the block of non-conductive material and configured to expose at least a portion of the heat spreader when the semiconductor package is disposed in the recess with the plurality of leads extending from the retainer. The pressure clamp is configured for disposing against an exterior of the retainer opposite to the body and attaching to the heat sink, for compressing the package against the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.