Ethernet frame encapsulation over VDSL using HDLC
US6587476B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 1999 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | May 26, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L12/40136
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
An apparatus for and method of encapsulating Ethernet frame data in HDLC frames for transmission over a VDSL transport facility. The HDLC frames are transmitted over a point to point VDSL link where they are subsequently extracted and forwarded as standard Ethernet frames. The VDSL facility transport system comprises one or more Ethernet to VDSL CPEs coupled to a DSLAM over a VDSL transport facility. The Ethernet to VDSL CPE functions to receive a 10BaseT Ethernet signal and encapsulate the Ethernet frame into a HDLC frame for transmission over the VDSL facility. In one embodiment, a single chip microcontroller on the CPE performs both Ethernet controller and HDLC controller functions. The DSLAM is adapted to receive HDLC frames from one or more CPEs, extract Ethernet frames therefrom and generate and output a standard Ethernet signal. Ethernet frames are encapsulated within HDLC frames and transmitted on the wire pair without regard to the state of the SOC signals. This overcomes the problems associated with synchronizing the transmission of the Ethernet data with the SOC signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.