Method for treating surfaces of substrates and apparatus
US6588122B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2002 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Apr 26, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/427
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method and apparatus for the treatment of surfaces of substrates of organic or inorganic materials, reactive fragments such as radicals or ions are produced by ultraviolet radiation from at least one ultraviolet radiator disposed at a given distance. The apparatus has a gas-filled, elongated discharge chamber whose walls are formed by a dielectric, and the ultraviolet radiator is provided on the side facing away from the discharge chamber with at least one electrode. During irradiation, a translational and/or rotatory relative movement is performed between the substrate and the ultraviolet radiator at a comparatively slight distance between radiator and substrate surface, in order to achieve, in a simple manner, an intense and uniform illumination of the surface being irradiated. The treatment is directed especially to silicon substrates or glass substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.