Patent · US Expired

Method and apparatus for cutting a laminate made of a brittle material and a plastic

US6588477B2 · kind B2 · utility

4Cited by
2References
45Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 31, 2001
Grant dateJul 8, 2003
Priority date
Expiry dateJul 31, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31649
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

The apparatus for cutting a laminate, which is made of a brittle material and a plastic, has a cutting tool for severing the plastic along a predetermined cutting line and simultaneously scoring the brittle material; a heating device for heating the plastic along the cutting line; a device for pressing the cutting tool with an adjustable pressure on the laminate; a device for moving the engaged cutting tool along the cutting line to simultaneously sever the plastic and score the brittle material and a controller for controlling the heating device so that during the severing and scoring a temperature of the cutting tool is maintained constant and the heating is sufficient to lower viscosity of the plastic along the cutting line so that a predetermined loading pressure of the cutting tool on the laminate necessary for simultaneously scoring the brittle material and severing the plastic is not exceeded, whereby uncontrollable fracture of the brittle material does not occur.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.