Thermosiphon for electronics cooling with high performance boiling and condensing surfaces
US6588498B1 · kind B1 · utility
59Cited by
8References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2002 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Jul 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermosiphon for cooling an electronic device having a mean width of dimension “b” comprises a boilerplate having a top surface and including a plurality of pyramid shaped fins projecting upwardly from the top surface. The boilerplate also has a bottom surface for receiving the electronic device to be cooled. A plurality of spaced apart condenser tubes is mounted above the boilerplate such that the boilerplate and the condenser tubes define a vapor chamber therebetween for receiving a working fluid therein. A plurality of convoluted fins extends between each adjacent pair of condenser tubes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.