Method and system for printing specific print zones using a bundled print head shuttle assembly
US6588877B2 · kind B2 · utility
6Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2001 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Nov 9, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J13/12
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method and system for printing specific print zones of a substrate is described. A bundled shuttle print head assembly is utilized to print desired print zones of a substrate in a single pass while the substrate is stationary in a stopped position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.