Patent · US Expired

Method for the manufacture of a substrate, substrate manufactured in accordance with this method, carrier wafer and diamond jewel

US6589333B1 · kind B1 · utility

8Cited by
9References
27Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 18, 2000
Grant dateJul 8, 2003
Priority date
Expiry dateSep 18, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S117/918
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method is described for the production of a suitable substrate for the subsequent growth of a mono-crystalline diamond layer. This method includes the following steps:Selection of a substrate of a mono-crystalline material having a fixed lattice constant (aSi) or with a layer consisting of such a material.Manufacture of a strained silicon layer with foreign material atoms incorporated at substitutional lattice sites on the mono-crystalline material of the substrate.Transfer of the strained layer into an at least partly relaxed state in which it adopts by relaxation and through the selected foreign material concentration a lattice constant (aSi(C) which satisfies the condition n.aSi(C)=m.aD, wherein n and m are integers and aD is the lattice constant of diamond, with the relaxed layer forming the substrate or substrate surface for the epitaxial growth.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.