Device for processing wafer
US6589386B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 11, 2000 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Aug 11, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for processing a substrate comprises a processing vessel (1), an outer vessel (2) for surrounding the processing vessel (1) which outer vessel (2) can be sealed, a first supporting member (4) for bringing the substrate (3) into and out from the processing vessel (1) which first supporting member (4) supports the substrate (3) in a standing manner, and a second supporting member (5) for transferring the substrate (3) between the first supporting member (4) which second supporting member (5) is movable up and down within the processing vessel (1). The device processes the entire surface of the substrate (3) uniformly and prevents varying in processing from occurrence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.