Embossing and laminating irregular bonding patterns
US6589634B2 · kind B2 · utility
29Cited by
163References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2001 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Aug 1, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24901
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Webs can be embossed and laminated using irregular bonding patterns with the pin-on-pin embossing process. Different patterns are provided onto each web and the webs are joined in a bonding nip to form a laminate. The bonding pattern formed in the bonding nip is irregular. The irregularity of the bonding pattern reduces vibrations within the machinery and allows increased machine speed. The irregularity of the pattern can be determined using the Self-Similarity Count or the Energy Suppression Factor method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.