Method of estimation of wafer-to-wafer thickness
US6589800B2 · kind B2 · utility
4Cited by
4References
8Claims
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Key dates
| Filing date | Aug 15, 2002 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Aug 15, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/03
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for extracting wafer-to-wafer thickness variation from interferometry signals off patterned (product) wafer polish during non-endpointed CMP. The method includes sensing sample signals representing polishing trace from product wafers near the end of polishing period from at least two product wafers (101); estimating the value of the phase of the first and second wafers using polish data near the end of the polish period using nonlinear regression algorithm processing (103) and the GOF test (104); and calculating the difference in final thickness using the phase (105).
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