Method for transferring semiconductor device layers to different substrates
US6589811B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 11, 2001 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Sep 11, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for transferring layers containing semiconductor devices and/or circuits to substrates other than those on which these semiconductor devices and/or circuits have been originally fabricated. The method comprises fabricating the semiconductor devices and/or circuits, coating them with a protective layer of photoresist followed by coating with a layer of wax. A special perforated structure is then also wax coated and the waxed surface of the structure is brought into a contact with the waxed surface of photoresist. The original seed substrate is removed and the exposed surface is then coated with adhesive followed by dissolving wax through the openings in the perforated structure and attaching the layer with semiconductor devices and/or circuits to another permanent substrate. As an alternative, a disk-shaped water-soluble structure can be used instead of the perforated structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.