Stabilized polyoxymethylene moulding materials

US6590020B1 · kind B1 · utility

Assignee

• BASF SE

Inventors

• Wolfgang Eberle · Mainz, DE
• Burkhardt Dames · Neuwied, DE

Key dates

• Filing date: Dec 18, 2000
• Grant date: Jul 8, 2003
• Expiry date: Dec 18, 2020

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K5/521
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic polyoxymethylene molding materials containingA) from 10 to 99.98% by weight of a polyoxymethylene homo- or copolymerB) from 0.005 to 2% by weight of a sterically hindered phenolC) from 0.001 to 2% by weight of a polyamideD) from 0.002 to 2% by weight of an alkaline earth metal silicate or of an alkaline earth metal glycerophosphateE) from 0.01 to 5% by weight of at least one ester or amide of saturated or unsaturated aliphatic carboxylic acids of 10 to 40 carbon atoms with polyols or aliphatic saturated alcohols or amines of 2 to 40 carbon atoms or an ether which is derived from alcohols and ethylene oxideF) from 0 to 5% by weight of a melamine/formaldehyde condensateG) from 0 to 74% by weight of further additives, the sum of the percentages by weight of the components A) to G) being 100% in each case.