Low-melting copolyamide and their use as hot-melt adhesives
US6590063B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2001 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | May 9, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31725
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Copolyamides, consisting of polycondensation products of the following components: caprolactam 10 to 45 mol-%, laurolactam 30 to 55 mol-%, at least 2 dicarboxylic acids 20 to 50 mol-% of the following compounds, aliphatic &agr;,&ohgr;-dicarboxylic acids with 6 up to 14 C atoms inclusively, terephthalic acid, isophthalic acid and 2,6-naphthalene dicarboxylic acid, wherein the content of aromatic dicarboxylic acids is lower than 10 mol-%, with reference to the allover amount of the above-mentioned components, which add up to 100 mol-%, a diamine mixture in an amount that is equimolar to that of the dicarboxylic acids, chosen from the group of the following substances, hexamethylene diamine, piperazine and/or 2-methyl-1,5-diaminopentane, wherein the molar content of hexa-methylene diamine is between 75 and 95 mol-% with reference to the diamine mixture.The copolyamides according to the invention are used for the production of mono- and multifilaments, fibers, films and nets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.