Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
US6590157B2 · kind B2 · utility
10Cited by
13References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2001 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Sep 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/851
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.