Disk-like gettering unit, integrated circuit, encapsulated semiconductor device, and method for manufacturing the same
US6590280B2 · kind B2 · utility
6Cited by
3References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2001 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Sep 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/92247
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A gettering unit encompasses a silicon substrate, a thin film heater disposed on the silicon substrate, and a gettering layer disposed selectively on the thin film heater. Here, the thin film heater is made of metallic film such as platinum (Pt) or chromium (Cr) film. The area of the gettering layer is smaller than the area for the thin film heater so as to expose first and second end terminals of the thin film heater. The first and second end terminals of the thin film heater serves as the bonding pads in the assembling process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.