Method and composition for mounting an electronic component and device formed therewith
US6590285B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2000 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Nov 28, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component. A composition for mounting a component on a circuit board includes a conductive adhesive screened on a contact pad, the conductive adhesive being partially cured, wherein the composition allows cold separation of the component from the substrate and may be fully cured by heat exposure. An apparatus is also…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.