Land grid array semiconductor device
US6590286B2 · kind B2 · utility
1Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2001 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Oct 23, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A land grid array semiconductor device provides greater positioning accuracy for an external electrode with respect to a mounting substrate. External electrodes are arranged on one surface of a substrate in area array. The external electrode includes an external electrode pad and an external electrode interconnection. Each external electrode pad includes a first pad layer having a cylindrical shape and a second pad layer covering the surface of the first pad layer and having a conical shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.