Heat dissipation device for enhanced power light emitting diodes
US6590773B1 · kind B1 · utility
12Cited by
8References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 28, 2002 |
| Grant date | Jul 8, 2003 |
| Priority date | — |
| Expiry date | Aug 28, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device is mounted to a light emitting diode device for removing heat from the light emitting diode which includes a substrate having a top side on which a light-emitting unit is formed and an opposite bottom side from which terminals extend. The heat dissipation device includes a plate made of heat conductive material and forming a receptacle for receiving and at least partially enclosing and physically engaging the substrate of the light emitting diode device for enhancing heat removal from the light emitting diode device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.