Cooling of substrate-supported heat-generating components
US6591625B1 · kind B1 · utility
40Cited by
6References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 17, 2002 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Apr 17, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/833
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Systems for cooling heat-generating components are provided. A representative embodiment of such a system includes a heat-generating component supported by a substrate. A microcompressor supported by the substrate compresses a cooling fluid. A heat exchanger supported by the substrate receives cooling fluid from the microcompressor and removes heat from the cooling fluid. A microexpander is thermally coupled to the heat-generating component and receives and expands the cooling fluid to remove heat from the heat-generating component. Methods and other systems also are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.