Apparatus and method for integrating an optical transceiver with a surface mount package
US6592269B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Aug 31, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4283
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An apparatus and method integrates optical transceivers for transfer of signals between optical and electronic media with surface mount packages, such as ball grid arrays and quad flat packs. A surface mount package is positioned directly beneath a modular optical transceiver. The surface mount package provides for electrically coupling external signals to the optical transceiver, so as to allow full performance functionality of data transfer components. An electrical coupling mechanism with high performance at high frequency is positioned between the surface mount package and the optical transceiver, electrically connecting them. In one implementation, the optical transceiver module is mounted directly to said surface mount package such that it is removable. In one embodiment, heat dissipation is provided by integral components and thermal vias, in addition to heat sinks. The apparatus, in one embodiment, allows optical transceivers to be modular and changeable, without connectors which can degrade high frequency signal transfer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.