Waferized power connector
US6592381B2 · kind B2 · utility
157Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Jan 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/24
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An interconnect system for printed circuit boards. The interconnect system includes signal wafers that carry high speed signals between printed circuit boards. The interconnect system also includes power modules assembled from wafers. The power modules are compact, easy to manufacture and easily integrate with the signal contact wafers to provide a single connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.