Wafer carrier and method of material removal from a semiconductor wafer
US6592434B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2000 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Mar 30, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer carrier (300) for a CMP tool is adjustable to provide center fast to edge fast material removal from a semiconductor wafer. The wafer carrier (300) holds the semiconductor wafer without vacuum. The semiconductor wafer is held by a carrier ring (308). An elastically flexed wafer support structure (318) is a support surface for the semiconductor wafer. Elastically flexed wafer support structure (318) can be bowed outward or bowed inward in an infinite number of different contours. The semiconductor wafer conforms to the contour of the elastically flexed wafer support structure (318) when a down force is applied to the wafer carrier (300) during a polishing process. Changing the contour is used to produce different material removal rates across the radius of the semiconductor wafer to increase wafer planarity in a polishing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.