Method for creating a coupling between a device and an ear structure in an implantable hearing assistance device
US6592513B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Sep 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R25/606
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for creating a coupling between an implantable device, such as a transducer, and a structure of the ear, such as an ossicle, in an implantable hearing assistance device. The device is positioned such that it either lightly touches or is positioned between a fraction of a millimeter to a few millimeters from the structure. The surface of either the device or the structure is cleaned and suctioned while the remaining surface, that is, the surface that has not been cleaned, is coated with a thin layer of solution. An adhesive material is applied to the space between the device and the structure and allowed to cure. The applied solution prevents a mechanical and/or chemical bond from forming at that interface while a bond does form at the remaining surface. Thus a coupling is created that permits slip between the device and the structure and provides a neutral load.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.