Patent · US Expired

Method for fabricating a multilayered structure and the structures formed by the method

US6592696B1 · kind B1 · utility

28Cited by
73References
28Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 21, 1999
Grant dateJul 15, 2003
Priority date
Expiry dateJan 21, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/1039
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method for fabricating a multilayered structure out of sheets of green-tape without the application of high pressures includes the step of applying an adhesive to the sheets of green-tape. Selection of an adhesive with a polymer that decomposes at a higher temperature than the binder present in the green-tape promotes stability of the interfaces during the firing process and promotes void-free sintering within the interfacial regions. A multilayered structure with internal electrical conduction pathways and with internal vias, channels, and cavities may be fabricated by this method

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.