Method for fabricating a multilayered structure and the structures formed by the method
US6592696B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1999 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Jan 21, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1039
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for fabricating a multilayered structure out of sheets of green-tape without the application of high pressures includes the step of applying an adhesive to the sheets of green-tape. Selection of an adhesive with a polymer that decomposes at a higher temperature than the binder present in the green-tape promotes stability of the interfaces during the firing process and promotes void-free sintering within the interfacial regions. A multilayered structure with internal electrical conduction pathways and with internal vias, channels, and cavities may be fabricated by this method
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.