Patent · US Expired

Method and apparatus for cutting a laminate made of a brittle material and a plastic

US6592703B1 · kind B1 · utility

57Cited by
3References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 5, 1999
Grant dateJul 15, 2003
Priority date
Expiry dateNov 5, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31649
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A method and an apparatus for cutting a laminate made of a brittle material and a plastic with a cutting tool is described. The plastic is heated up, thereby lowering its viscosity, at least in the region of a predetermined cutting line. A cutting tool is placed onto the plastic side of the laminate, the loading pressure being adjustable. By moving cutting tool relative to the laminate along the predetermined cutting line, the plastic is severed; at the same time the brittle material is scored, thereby inducing a mechanical stress. If appropriate, the mechanical stress along the cutting line is subsequently increased to exceed the rupture strength of the scored brittle material. A preferred application is the cutting of thin glass or glass-ceramic/plastic laminates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.