Electrolytic process for treating a conductive surface and products formed thereby
US6592738B2 · kind B2 · utility
7Cited by
102References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Apr 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/282
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an electrolytic process to deposit a silicate containing coating or film upon a metallic or conductive surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.