Thermoplastic hollow molded body
US6592955B1 · kind B1 · utility
7Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Jul 12, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Multilayer hollow body comprising an inner layer which comprises a conductive compound based on a virgin polyolefin or a virgin polyamide, an outer layer comprising a virgin polyolefin, a layer which is a barrier to hydrocarbons, at least one adhesive and at least one layer comprising recycled plastic.Process for manufacturing this hollow body using the technique of coextrusion blow moulding, comprising a step of extruding a parison, a step of transversely preforming the parison by means of a tool and a moulding step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.