Infrared sensor
US6593519B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 23, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Jul 23, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/10
Abstract
An infrared sensor is provided with a thermopile formed with a plurality of thermocouples connected to each other. The thermopile includes hot junctions, cold junctions, and thermoelectric patterns. The thermoelectric patterns are made of thermoelectric materials differing from each other. The hot junctions and the cold junctions are made of a bonding material which differs from the thermoelectric materials. A temperature-compensation resistor film is formed at a corner of the surface of a substrate on which the thermopile is formed, the temperature-compensation resistor film being made of the same material as the bonding material used for the hot junctions and the cold junctions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.