Thermal management system
US6594147B2 · kind B2 · utility
3Cited by
29References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Nov 27, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/1611
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for removing heat from heat generating elements is disclosed. The apparatus is a thermal management system having a thermal distribution assembly in either one of or both of conductive and radiative communication with heat generating elements. The thermal distribution assembly has thermal zones, each of which is associated with at least one heat generating element. The thermal distribution assembly includes a heat spreading frame and a heat conducting frame. Heat passes from the heat generating elements to the heat conducting frame and then to the heat spreading frame, from which the heat is removed via convection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.