Low cost MMW transceiver packaging
US6594479B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2000 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Sep 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/03
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A millimeter wave transceiver package is provided. Housings for electronic, RF, and support components of the transceiver with an RF transparent cover are stacked vertically in a multilayer structure. The channelized RF housing affects a reduction of 5:1 by minimizing the components placed on the housing. The design and position of the regulator/controller allows the use of surface mount parts and simplified DC and RF interfaces further contributing to design efficiency and reduced costs. Additionally, costs are reduced through the appropriate selection and application of materials. The generic housing for the millimeter wave module assembly accommodates frequencies from 20 to 40 GHz without design change, thus improving the modular character.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.