Routable high-density interfaces for integrated circuit devices
US6594811B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 26, 2001 |
| Grant date | Jul 15, 2003 |
| Priority date | — |
| Expiry date | Nov 8, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Patterns for a routable interface of the signal lines of a integrated circuit device include several groups of terminals distributed about the pattern center, each group clustered along a corresponding curvilinear reference segment extending outward from the pattern center to its perimeter. Routability zones are created between each successive pair of groups. For higher terminal density, in at least one of the terminal groups of the pattern, either the offset of the terminals from the reference line segment is not uniform, or the distance of the terminals from the pattern center does not increase uniformly. A portion, preferably at least about 50% of the terminals in a group of the pattern are not collinear with, but offset from, the reference segment. A portion, preferably at least about 90% of the terminals in a given terminal group are each closer to the reference line segment of that terminal group than they are to the reference segment of another terminal group. The patterns of this invention can be employed on IC chips, IC package layers and PCB layers for patterning of terminals, pins, via, pads and another connector devices useful in IC devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.