Method of making surface laminar circuit board
US6594893B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2001 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Oct 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A surface laminar circuit board includes an insulating layer, and a signal ground conductive layer disposed on an upper surface of the insulating layer. The conductive layer has a hole formed therein. A photosensitive dielectric layer is disposed on an upper surface of the signal ground conductive layer. The dielectric layer has a photo micro-via formed therein. A signal trace is disposed on the photosensitive dielectric layer, and is electrically coupled with the signal ground conductive layer by way of the photo micro-via. A conductive pad is provided, which has a majority thereof within an area defined by an outer periphery of the hole. The conductive pad is electrically coupled with the signal trace. A surface mounted component is mounted on the conductive pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.