Using micro heat pipes as heat exchanger unit for notebook applications
US6595270B2 · kind B2 · utility
7Cited by
14References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2001 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Jun 29, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A system including a plurality of micro heat pipes is used to transfer heat from a die. A die attach block is coupled with the die. The plurality of micro heat pipes (MHPs) are attached to the die attach block to enable the MHPs to be in close contact with the die to absorb heat generated by the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.