Method of producing electronic part with bumps and method of producing electronic part
US6595404B2 · kind B2 · utility
9Cited by
16References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2001 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Nov 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.