Carbon fiber and copper support for physical vapor deposition target assembly and method of forming
US6596131B1 · kind B1 · utility
8Cited by
5References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2000 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Oct 30, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3407
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention includes a method of forming an assembly of a physical vapor deposition target and support. A physical vapor deposition target is provided. The physical vapor deposition target has a coefficient of thermal expansion of less than 10×10−6K−1. The physical vapor deposition target is joined to a support. The support comprises a thermal coefficient of expansion of less than 11×10−6K−1. The invention also includes an assembly comprising a physical vapor deposition target and a support joined to the physical vapor deposition target. The support comprises carbon fibers and copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.