Electronic material composition, electronic parts and use of electronic material composition
US6596200B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2000 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Nov 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is an electronic material composition which is capable of forming a cured film exhibiting a desired glass transition temperature, a desired stiffness modulus in a rubbery state and a desired extensibility at low temperatures. Also provided is an electronic component comprising a molded body, a packed body, a covering body, an electrode or a joining body, all being formed of the aforementioned electronic material composition. Also provided is a method of using the aforementioned electronic material composition, which is featured in that the electronic material composition is applied in a semi-cured state, and after the application thereof, completely cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.