Sealable package for heating in a microwave oven
US6596355B1 · kind B1 · utility
13Cited by
2References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2000 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Oct 3, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31797
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A packaging material is composed of a heat resistant base layer, a sealant layer, and a resin layer disposed at least a portion between the heat-resistant base layer and the sealant layer. The resin layer is composed of a resin material having a predetermined strength in a non-heated temperature state of less than a room temperature and this strength is lowered in a high temperature state heated, for example, by a microwave oven. Such packaging material can be effectively utilized for many kinds of packaging bags or containers with the sealant layer being disposed to the inner content side of the bag or container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.