Very ultra thin conductor layers for printed wiring boards
US6596391B2 · kind B2 · utility
5Cited by
15References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 11, 1998 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | May 11, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31692
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a metal-clad laminate product having a carrier film, a aqueous soluble release or parting layer deposited onto the carrier film and which can be mechanically separated from the carrier film, and an ultra thin metal layer deposited onto the parting layer. Also disclosed is a method for making the metal-clad laminate product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.