Processor and power supply circuit
US6596948B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2000 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Apr 28, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high performance processor assembly is electrically connected to a power supply so as to minimize voltage variations associated with the supply of power to the processor assembly. The processor assembly is fabricated on a multilayered printed circuit board. Power is supplied to components on the printed circuit board by way of parallel and split power planes. The parallel and split power planes reduce inductance and increase capacitance associated therewith. The reduced inductance reduces voltage variations caused by load transient currents. Capacitors are electrically connected to the power planes by way of multiple vias to further reduce inductance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.