Integrated circuit arrangement with a number of structural elements and method for the production thereof

US6597053B1 · kind B1 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Anton Anthofer · Freihung, DE
• Holger Hubner · Baldham, DE

Key dates

• Filing date: Oct 15, 1999
• Grant date: Jul 22, 2003
• Expiry date: Oct 15, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1305
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit arrangement having a number of structural elements, at least one of which is surrounded by a metallic shielding structure. This structural element is thus protected against interference due to disturbing impulses from its environment. In particular, the structural elements of the circuit arrangement can be arranged next to or on top of one another. To produce the metallic shielding structure of a structural element of the circuit arrangement, at least one depression which surrounds the structural element is created and then lined with metal. The contacts and electrical connections of the structural element are electrically insulated from the metal of the shielding structure. To connect two structural elements within a three-dimensional circuit arrangement, the surfaces of the structural elements that face one another can be covered with two different metals, the alloy thereof having a melting point TS above the melting point T1 of at least one of the metals, so that heating to a temperature between the two melting points results in a permanent connection.